Rigid-Flex PCB

  • Model: Rigid-Flex PCBs »
Featuretechnical specification
Number of layers4-16 layers
Technology highlightsMixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
Bending performanceBased on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.
Bend featuresBend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.
MaterialsRA copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished)½ ounce, 1 ounce, 2 ounce, 3 ounce
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.4mm to 3mm
PCB thickness in flex section0.05mm to 0.8mm
Maxmimum dimensions457mm to 610mm
Surface finishes availableENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill0.20mm




Suitable model HUAWEI flat M3

Features M3 tablet customized AKG brand high fidelity headphones, with the M3 tablet to enjoy the HiFi sound quality


The length is 1100 + 43mm